Qualcomm upgrades one of its built-in fingerprint sensors. The second generation 3D sonic sensor is 77% larger than its predecessor. It covers an area of 64 square millimeters (8 mm x 8 mm) against 36 square millimeters of the first version (4 mm x 9 mm).
According to Qualcomm, the larger size will allow the reader to collect 1.7 times more biometric data, as there will be more space for your finger. The company claims the sensor can also process data 50% faster than the old one, so it should unlock phones faster.